Kaisi A-9 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 6s Plus / 6s Kaisi A-9 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 6s Plus / 6s Kaisi A-9 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 6s Plus / 6s Kaisi A-9 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 6s Plus / 6s
Kaisi A-9 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 6s Plus / 6s Kaisi A-9 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 6s Plus / 6s Kaisi A-9 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 6s Plus / 6s Kaisi A-9 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 6s Plus / 6s

Kaisi A-9 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 6s Plus / 6s

10 available / new
- +
10 available
R221.00
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The seller has indicated that they will usually have this item ready to ship within 15 business days. Shipping time depends on your delivery address. The most accurate delivery time will be calculated at checkout, but in general, the following shipping times apply:
 
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Main centres:  1-3 business days
Regional areas: 3-4 business days
Remote areas: 3-5 business days
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Product details

Condition
New
Location
International
Product code
SP7729
Bob Shop ID
619214391

Kaisi A-9 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 6s Plus / 6s


1. Professional tool for mobile phones repairing.
2. Suitable for iPhone 6 Plus / 6.
3. The unique holes design makes it easier to take out the formed solder balls.
4. This stencil is easy to use no matter you are a new or expert.
5. Special design enables stencil to align with tinning position of CPU rapidly.
6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.
7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.
8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.
9. Special steel manufacturing, high temperature resistance, no deformation.
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